By using wafers to reduce product size, the goal of lightweight and miniaturization is achieved.

Chip bonding is carried out in an environment with nitrogen and hydrogen protective gases.

Aluminum wire: 5 μ Mil, 8 μ Mil, 12 μ Mil equal line diameter.

Gold line: 0.6-2 μ Mil gold wire with equal wire diameter.

Customized wire arc, suitable for small-sized power packaging.

There are a total of 12 independent temperature detection and control units for the upper and lower molds, ensuring good temperature uniformity.

1 mold (80 or 56 pieces)/5 minutes.

Automatic tin loading, high production efficiency and stable quality

Spot welding

Resistance welding

Deep cavity welding

Time, pressure, and other data can be set according to different products and applications;

Precision resistance welding is a welding process that precisely controls the welding current and electrode pressure to melt and fuse the parts of two metal parts that are in close contact.

This welding process can be used to connect metal parts of different materials, with advantages such as high accuracy, consistent welding seams, and no need for filling materials..

Laser welding is a method of welding that uses a focused laser beam as the energy source to bombard the heat generated by the welded part.

Laser welding has the characteristics of heat concentration, small welding deformation, and being unaffected by electromagnetic fields...